Thin multichip flex-module
US7787254B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 7, 2007 |
| Grant date | Aug 31, 2010 |
| Priority date | — |
| Expiry date | Jun 13, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2018
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multichip module comprises: a first rigid member defining one outer wall of a chamber; a second rigid member defining the opposite wall of the chamber; a sealable interface joining the first and second rigid members at their peripheries, whereby a hollow chamber is formed; a flex circuit having a plurality of integrated circuit chips disposed thereon, the flex circuit affixed to at least one of the first and second rigid members; electrical contacts at least partially extending outward through the sealable interface; and, a fluid inlet and a fluid outlet configured to permit fluid to flow through the chamber whereby heat generated by the integrated circuit chips may be removed from the module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.