Packaging device and packaging method for hollow cathode type sputtering target
US7788882B2 · kind B2 · utility
1Cited by
7References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 14, 2004 |
| Grant date | Sep 7, 2010 |
| Priority date | — |
| Expiry date | Aug 19, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65D81/2023
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
Provided are a packaging device and packaging method of a hollow cathode sputtering target which installs, in the hollow cathode sputtering target, a cover of a size capable of covering a void of the target; provides one or more through-holes to the cover; places a resin bag over them, and performs vacuum suction to the inside of the bag. This packaging device and packaging method of a hollow cathode sputtering target is capable of performing vacuum suction even to the inside of the hollow portion covered with the resin bag.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.