Circuit for and method of implementing a capacitor in an integrated circuit
US7791192B1 · kind B1 · utility
15Cited by
7References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 27, 2006 |
| Grant date | Sep 7, 2010 |
| Priority date | — |
| Expiry date | Jan 27, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package has a substrate; a discrete capacitor coupled to a first surface of the substrate; an integrated circuit die coupled to the first surface of the substrate over the discrete capacitor; and a lid coupled to the substrate, the lid encapsulating the integrated circuit die and the discrete capacitor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.