Pad over active circuit system and method with meshed support structure
US7791193B2 · kind B2 · utility
2Cited by
10References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 20, 2007 |
| Grant date | Sep 7, 2010 |
| Priority date | — |
| Expiry date | Nov 6, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit and method of fabricating the same are provided. Included are an active circuit, and a metal layer disposed, at least partially, above the active circuit. Further provided is a bond pad disposed, at least partially, above the metal layer. To prevent damage incurred during a bonding process, the aforementioned metal layer is meshed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.