Patent · US Active

Multi-layer embedded capacitance and resistance substrate core

US7791897B2 · kind B2 · utility

13Cited by

21References

14Claims

0Family size

Assignee

Endicott Interconnect Technologies, Inc. · US

Inventors

Rabindra N. Das · Lexington, US
John M. Lauffer · Waverly, US
Irving Memis · Vestal, US
Steven G. Rosser · Owego, US

Key dates

Filing date	Sep 9, 2008
Grant date	Sep 7, 2010
Priority date	—
Expiry date	Sep 9, 2028

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/31511
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A multi-layer imbedded capacitance and resistance substrate core. At least one layer of resistance material is provided. The layer of resistance material has a layer of electrically conductive material embedded therein. At least one layer of capacitance material of high dielectric constant is disposed on the layer of resistance material. Thru-holes are formed by laser.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.