Selective electrochemical accelerator removal
US7799200B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 5, 2006 |
| Grant date | Sep 21, 2010 |
| Priority date | — |
| Expiry date | Jul 22, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/7684
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods and apparatus are provided for planar metal plating on a workpiece having a surface with recessed regions and exposed surface regions; comprising the steps of: causing a plating accelerator to become attached to said surface including the recessed and exposed surface regions; selectively removing the plating accelerator from the exposed surface regions without performing substantial metal plating on the surface; and after removal of plating accelerator is at least partially complete, plating metal onto the surface, whereby the plating accelerator remaining attached to the surface increases the rate of metal plating in the recessed regions relative to the rate of metal plating in the exposed surface regions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.