Patent · US Active

Method and apparatus for the treatment of a semiconductor wafer

US7799692B2 · kind B2 · utility

0Cited by

1References

13Claims

0Family size

Assignee

Siltronic AG · DE

Inventors

Brian Murphy · Pfarrkirchen, DE
Diego Feijoo · Burghausen, DE
Reinhold Wahlich · Burghausen, DE

Key dates

Filing date	May 17, 2007
Grant date	Sep 21, 2010
Priority date	—
Expiry date	Dec 2, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH01L22/20
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

Treatment of a semiconductor wafer employs:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.