Stackable package by using internal stacking modules
US7800211B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2007 |
| Grant date | Sep 21, 2010 |
| Priority date | — |
| Expiry date | Jan 16, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package has a substrate with solder balls. A first semiconductor die is disposed on the substrate. A first double side mold (DSM) internal stackable module (ISM) is in physical contact with the first semiconductor die through a first adhesive, such as a film on wire adhesive. A second DSM ISM is in physical contact with the first DSM ISM through a second adhesive. The arrangement of the first and second DSM ISM reduce headroom requirements for the package and increase device packing density. Each DSM ISM has semiconductor die disposed in cavities. An interposer is disposed above the top DSM ISM. Wire bonds connect the semiconductor die and DSM ISMs to the solder balls. An encapsulant surrounds the first semiconductor die and first DSM ISM with an exposed mold area in the encapsulant above the interposer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.