Wire bond integrated circuit package for high speed I/O
US7804167B2 · kind B2 · utility
1Cited by
13References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 1, 2006 |
| Grant date | Sep 28, 2010 |
| Priority date | — |
| Expiry date | Nov 2, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package includes a package substrate, a die attach pad formed on the package substrate for securing a die to the package substrate, a ground bonding ring formed on the package substrate for attaching core and I/O ground bond wires between the die and the package substrate, and a first plurality of bond fingers formed immediately adjacent to the ground bonding ring for attaching a first set of I/O signal bond wires between the package substrate and the die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.