Wafer inspecting method
US7804591B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 29, 2007 |
| Grant date | Sep 28, 2010 |
| Priority date | — |
| Expiry date | Apr 28, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2021/8887
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A wafer inspecting method including the steps of: multi-scanning a pattern image of a unit inspection region in a normal state and a pattern image of a unit inspection region to be inspected, respectively, using different inspection conditions; comparing the multi-scanned pattern images in the normal state with the multi-scanned pattern images to be inspected obtained by the same inspection conditions, and storing differences between the pattern images as difference images; generating a discrimination difference image by calculating a balance between the stored difference images; and discriminating a defect from noise by using the discrimination difference image.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.