MEMS microphone module and method thereof
US7808060B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 21, 2007 |
| Grant date | Oct 5, 2010 |
| Priority date | — |
| Expiry date | Jan 27, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2201/0257
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A MEMS microphone module having an application specific IC and a microphone chip is disclosed. The application specific IC has a plurality of first vias and a plurality of first pads, and the first vias are connected to the first pads. The microphone chip has a resonant cavity, a plurality of second vias and a plurality of second pads, and the second vias are connected to the second pads. The microphone chip is disposed on a first surface of the application specific IC with an opening of the resonant cavity facing toward a first surface of the application specific IC. The second conductive vias of the microphone chip are also electrically connected to the first vias of the application specific IC. By placing the microphone chip on the first surface of the application specific IC, the present invention could reduce the package size and increase the reliability of the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.