Apparatus and methods for high-performance liquid cooling of multiple chips with disparate cooling requirements
US7808781B2 · kind B2 · utility
32Cited by
6References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 13, 2008 |
| Grant date | Oct 5, 2010 |
| Priority date | — |
| Expiry date | Sep 7, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/10253
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Apparatus and methods are provided for packaging multi-chip modules with liquid cooling modules designed to provide different thermal resistances for effectively conducting heat from various chips with disparate cooling requirements while minimizing mechanical stresses in thermal bonds due to thermal excursions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.