Patent · US Active

Package and the method for making the same, and a stacked package

US7811858B2 · kind B2 · utility

23Cited by

5References

11Claims

0Family size

Assignee

ADVANCED SEMICONDUCTOR ENGINEERING, INC. · TW

Inventors

Meng-Jen Wang
Wei-Chung Wang · Tangxia, CN

Key dates

Filing date	Aug 5, 2008
Grant date	Oct 12, 2010
Priority date	—
Expiry date	Sep 16, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/18301
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A package and the method for making the same, and a stacked package, the method for making the package includes the following steps: (a) providing a carrier having a plurality of platforms; (b) providing a plurality of dice, and disposing the dice on the platforms; (c) performing a reflow process so that the dice are self-aligned on the platforms; (d) forming a molding compound in the gaps between the dice, and (e) performing a cutting process so as to form a plurality of packages. Since the dice are self-aligned on the platforms during the reflow process, a die attach machine with low accuracy can achieve highly accurate placement.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.