Method of making a semiconductor chip assembly with metal pillar and encapsulant grinding and heat sink attachment
US7811863B1 · kind B1 · utility
8Cited by
174References
100Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 1, 2009 |
| Grant date | Oct 12, 2010 |
| Priority date | — |
| Expiry date | Jun 25, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of making a semiconductor chip assembly includes mechanically attaching a semiconductor chip to a routing line, forming a metal pillar on the routing line, forming an encapsulant that covers the chip and the metal pillar, grinding the encapsulant without grinding the metal pillar, then grinding the encapsulant and the metal pillar such that the encapsulant and the metal pillar are laterally aligned, and then attaching a heat sink to the metal pillar.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.