Rapid conductive cooling using a secondary process plane
US7812286B2 · kind B2 · utility
12Cited by
22References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 26, 2007 |
| Grant date | Oct 12, 2010 |
| Priority date | — |
| Expiry date | Oct 9, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for thermally processing a substrate is described. The apparatus includes a substrate support configured to move linearly and/or rotationally by a magnetic drive. The substrate support is also configured to receive a radiant heat source to provide heating region in a portion of the chamber. An active cooling region comprising a cooling plate is disposed opposite the heating region. The substrate may move between the two regions to facilitate rapidly controlled heating and cooling of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.