Semiconductor memory module having an oblique memory chip
US7812445B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2007 |
| Grant date | Oct 12, 2010 |
| Priority date | — |
| Expiry date | May 14, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a semiconductor memory module allowing a filling member formed between a module substrate and memory chips mounted on the module substrate to completely fill the space between the module substrate and the memory chips. According to embodiments of the present invention, the semiconductor memory module includes a module substrate having at least one memory chip mounted on the substrate such that its edges are oblique to major and minor axes bisecting the module substrate. The oblique orientation allows for an improved opening between memory chips formed on the substrate so that the filling member may be properly formed between the module substrate and the memory chips to prevent voids where the filling member is not formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.