Method of making circuitized substrate with filled isolation border
US7814649B2 · kind B2 · utility
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14References
6Claims
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Key dates
| Filing date | Jul 10, 2006 |
| Grant date | Oct 19, 2010 |
| Priority date | — |
| Expiry date | Oct 7, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of making a circuitized substrate which includes a plurality of contiguous open segments along a side edge portion of the at least one electrically conductive layer thereof, these open segments isolated by a barrier of dielectric material which substantially fills the open segments, e.g., during a lamination process which bonds two dielectric layers of the substrate to the conductive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.