Pad conditioner
US7815495B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 11, 2007 |
| Grant date | Oct 19, 2010 |
| Priority date | — |
| Expiry date | Jun 8, 2028 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B53/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A pad conditioner is provided for conditioning a polishing pad in chemical mechanical planarization (CMP). The pad conditioner comprises a plastic abrasive portion having a first hardness and optionally a brush portion having a second hardness less than the first hardness. The plastic abrasive portion comprises a base plate and a plurality of plastic nodules formed on a surface of the base plate, each of the plastic nodules having a planar top surface, wherein the planar top surface is positioned to substantially contact a polishing pad. The brush portion may be positioned adjacent to the plastic abrasive portion, the brush portion having a plurality of brush elements positioned to substantially contact the pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.