Semiconductor package and method for producing the same
US7816235B2 · kind B2 · utility
11Cited by
3References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 23, 2007 |
| Grant date | Oct 19, 2010 |
| Priority date | — |
| Expiry date | Nov 4, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes a rewiring substrate and a semiconductor chip. The semiconductor chip includes: a first face with an active surface including integrated circuit devices and chip contact pads, a second face lying in a plane essentially parallel to the first face and side faces. Each side face of the semiconductor chip lies in a plane essentially perpendicular to the first and second faces. At least one edge between two mutually essentially perpendicular faces of the semiconductor chip includes a surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.