Resist coating method and resist coating apparatus
US7820243B2 · kind B2 · utility
6Cited by
3References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 16, 2006 |
| Grant date | Oct 26, 2010 |
| Priority date | — |
| Expiry date | Jul 5, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/162
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A resist coating method supplies a resist solution to substantially the center of a target substrate to be processed while rotating the target substrate at a first rotational speed, then decelerates the rotation of the substrate to a second rotational speed lower than the first rotational speed, or until rotational halt, makes the deceleration smaller in the deceleration step as the rotational speed becomes closer to the second rotational speed or the rotational halt, and accelerates the rotation of the substrate to a third rotational speed higher than the second rotational speed to spin off a residue of the resist solution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.