Semiconductor device package having buffered memory module and method thereof
US7821127B2 · kind B2 · utility
9Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 13, 2005 |
| Grant date | Oct 26, 2010 |
| Priority date | — |
| Expiry date | Jun 16, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus of fabricating a semiconductor device are disclosed. The semiconductor device may include a buffer chip package having a buffer chip mounted on a buffer chip substrate and at least one memory package mounted on the buffer chip substrate, wherein the at least one memory package may include a plurality of memory chips. Further, the buffer chip package may have a plurality of external connection terminals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.