Stacked redistribution layer (RDL) die assembly package
US7825520B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 5, 2009 |
| Grant date | Nov 2, 2010 |
| Priority date | — |
| Expiry date | May 5, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A stacked redistribution layer (RDL) die assembly package includes a substrate, a first level RDL die assembly mounted to the substrate and a second level RDL die assembly mounted to the first level RDL die assembly. The first level RDL die assembly includes a first die comprising bond pads, a first fan out support extending outwardly from sides of the first die, and first traces electrically connected to the bond pads, the first traces being supported by the first fan out support. Similarly, the second level RDL die assembly includes a second die comprising bond pads, a second fan out support extending outwardly from sides of the second die, and second traces electrically connected to the bond pads of the second die, the second traces being supported by the second fan out support.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.