MEMS microphone package and method thereof
US7829961B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 21, 2007 |
| Grant date | Nov 9, 2010 |
| Priority date | — |
| Expiry date | May 6, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2201/003
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A MEMS microphone package includes a carrier, an application specific IC, an encapsulant and a microphone chip. The application specific IC and the microphone chip are respectively disposed on first and second surfaces of the carrier, and the application specific IC and the microphone chip are electrically connected to the carrier. The encapsulant includes first and second encapsulants, the first encapsulant is formed on the first surface to seal the application specific IC, the second encapsulant is formed on the second surface to become a cavity and the microphone chip is located at the cavity. Because the application specific IC and the microphone chip are disposed on the first and second surfaces of the carrier, respectively, the second encapsulant surrounds the microphone chip, and the first and second encapsulants are formed at the same time, it can increase the structural strength of package and reduce the process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.