Semiconductor package capable of performing various tests and method of testing the same
US7831405B2 · kind B2 · utility
1Cited by
5References
24Claims
0Family size
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Key dates
| Filing date | Jul 17, 2007 |
| Grant date | Nov 9, 2010 |
| Priority date | — |
| Expiry date | Apr 8, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/31701
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A semiconductor package includes an input pin that receives a first signal from the outside of the semiconductor package, a pad that is coupled to the input pin, and a test mode driving circuit that receives the first signal from the pad and outputs a plurality of test mode signals to drive a test apparatus in a semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.