Method for decreasing surface delamination of gel-type thermal interface material by management of the material cure temperature
US7833839B1 · kind B1 · utility
14Cited by
9References
21Claims
0Family size
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Key dates
| Filing date | Sep 15, 2007 |
| Grant date | Nov 16, 2010 |
| Priority date | — |
| Expiry date | Aug 20, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Various methods and apparatus for establishing a thermal pathway for a semiconductor device are disclosed. In one aspect, a method of manufacturing is provided that includes placing a gel-type thermal interface material in a preselected pattern on a semiconductor chip that is coupled to a substrate. The preselected pattern of gel-type thermal interface material is allowed to partially set up. Additional thermal interface material is placed on the semiconductor chip and cured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.