Leadframe for packaged electronic device with enhanced mold locking capability
US7834431B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 8, 2008 |
| Grant date | Nov 16, 2010 |
| Priority date | — |
| Expiry date | Nov 14, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18301
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A packaged electronic device (20) includes a die pad (30), leads (32) arranged around the die pad (30), and a die (24) attached to an upper surface (34) of the die pad (30) and electrically connected to the leads (32). A packaging material (28) encapsulates the die pad (30), the die (24), and the leads (32). The die pad (30) includes indentations (42) formed in the upper surface (34) along a sidewall (38) of the die pad (30). The die pad (30) further includes indentations (44) formed in a lower surface (36) of the die pad (30) along the sidewall. The packaging material (28) fills the indentations (42, 44) thereby promoting adhesion between the die pad (30) and the packaging material (28) so that the die pad (30) and packaging material (28) cannot readily delaminate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.