Apparatus for heating or cooling a polishing surface of a polishing apparatus
US7837534B2 · kind B2 · utility
15Cited by
10References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 6, 2008 |
| Grant date | Nov 23, 2010 |
| Priority date | — |
| Expiry date | Jul 9, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B55/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention provides an apparatus for heating or cooling a polishing surface. This apparatus includes a heat exchanger arranged so as to face the polishing surface when the workpiece is polished. The heat exchanger includes a medium passage through which a heat-exchanging medium flows, and a bottom surface facing the polishing surface. At least a part of the bottom surface is inclined with an upward gradient above the polishing surface such that a polishing liquid on the polishing surface generates a lift exerted on the bottom surface during movement of the polishing surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.