Process chamber, inline coating installation and method for treating a substrate

US7837796B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Juergen Henrich · Limeshain, DE
• Michael Schaefer · Heidenau, DE
• Edgar Haberkorn · Bad Orb, DE

Key dates

• Filing date: Feb 28, 2007
• Grant date: Nov 23, 2010
• Expiry date: Jan 8, 2028

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C23C16/54
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A process chamber 1 for PECVD (Plasma Enhanced Chemical Vapor Deposition) coating of a substrate includes an electrode, which is integrated in a contact frame, which is firmly connected to the recipient. A movable carrier in the process chamber carries at least one substrate. The carrier is transported by means of a driven roller positioner into the process chamber or out of the process chamber along a transport route defined by the movement. As soon as the carrier inside the recipient has reached a certain position, the lower roller positioner is uncoupled from carrier by lowering by means of a lifting device. In this regard, the carrier detaches itself from the upper roller positioner. Then, the carrier is accepted by a transfer device (not shown) and brought from the transport position laterally into a treatment position in contact with the contact frame. In this way, reliable contact is produced between the electrode and a counter-electrode provided in carrier. At the same time, other carriers, in so far as the contact frame is removed laterally far enough from the transport route, during the coating of the carrier, can be moved past this.