Measurement and control of strained devices
US7838309B1 · kind B1 · utility
2Cited by
4References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 27, 2008 |
| Grant date | Nov 23, 2010 |
| Priority date | — |
| Expiry date | Aug 27, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B2210/56
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method that includes measuring stress on at least one of a monitor substrate, a production substrate, and a proxy device on a production substrate to produce stress data, measuring shape on at least one of a proxy device on a production substrate and a production device on a production substrate to produce shape data, and inputting the stress data and the shape data into an elastic deformation calculation to determine a stress value for a production device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.