Patent · US Active

Systems incorporating microwave heaters within fluid supply lines of substrate processing chambers and methods for use of such systems

US7845308B1 · kind B1 · utility

6Cited by
4References
16Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 28, 2006
Grant dateDec 7, 2010
Priority date
Expiry dateOct 7, 2029

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05B6/806
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

Systems having an in-line microwave heater to heat fluids for processing a substrate are provided. An embodiment of a system includes a microelectronic processing chamber, a reservoir for storing a fluid used to process wafers within the chamber, a supply line for transporting the fluid to the chamber, and a microwave heater arranged along the supply line. The system includes processor executable program instructions for operating the microwave heater at parameters configured to heat fluid within the supply line to a temperature greater than a fluid temperature within the reservoir, such as approximately 20° C. greater than the reservoir fluid temperature. It is noted that the inclusion of an in-line microwave heater is not limited to microelectronic fabrication systems, but may be used for any system in which heated fluids are used for processing a substrate, such as but not limited to electroplating or electroless plating systems.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.