Polishing device and substrate processing device
US7850817B2 · kind B2 · utility
9Cited by
12References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 9, 2003 |
| Grant date | Dec 14, 2010 |
| Priority date | — |
| Expiry date | Nov 3, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68707
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A polishing apparatus has a plurality of polishing units. Moving mechanisms for moving top rings between polishing positions on polishing surfaces and wafer receiving/delivering positions are provided in each of the polishing units. Linear transporters are provided for transferring a wafer between a plurality of transferring positions including the wafer receiving/delivering positions. Pushers for receiving and delivering the wafer between the linear transporters and the top rings are provided at the transferring positions as the wafer receiving/delivering positions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.