Patent · US Active

Apparatus and method for producing semiconductor modules

US7851334B2 · kind B2 · utility

0Cited by

3References

21Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Roland Speckels · Kamen, DE
Karsten Guth · Soest, DE
Hans Hartung · Warstein, DE

Key dates

Filing date	Jul 20, 2007
Grant date	Dec 14, 2010
Priority date	—
Expiry date	Aug 28, 2027

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/15787
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An apparatus and method for producing semiconductor modules is disclosed. One embodiment provides for bonding at least one semiconductor die onto a carrier including a support film strip, the support film having applied an adhesive layer to one of its surfaces to attach the semiconductor die, and a pressure tool to press the semiconductor die and the support film strip onto the carrier to permanently contact the at least one semiconductor die to the carrier.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.