Method and apparatus for reviewing defects
US7851753B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 3, 2006 |
| Grant date | Dec 14, 2010 |
| Priority date | — |
| Expiry date | Dec 23, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/2817
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The invention provides an apparatus and a method each capable of highly accurately reviewing at a high speed very small foreign matters and pattern defects occurring during a device production process for forming a circuit pattern on a substrate of semiconductor devices, etc. An objective lens having high NA is installed inside a vacuum chamber for an inspection object having a transparent film formed on the surface thereof and an illumination optical path is formed inside the objective lens so that dark visual field illumination can be made and reflected and scattered light of foreign matters or defects on the surface of the inspection object can be detected with high sensitivity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.