Memory device having cross-shaped semiconductor fin structure
US7851844B2 · kind B2 · utility
9Cited by
3References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 14, 2008 |
| Grant date | Dec 14, 2010 |
| Priority date | — |
| Expiry date | Dec 5, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/037
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
In an embodiment, a memory device, including: a semiconductor fin structure, each end portion of the fin structure including a source/drain region; a charge storage layer covering at least a portion of the fin structure; and a gate layer covering at least a portion of the charge storage layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.