Heat sink
US7856341B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 19, 2008 |
| Grant date | Dec 21, 2010 |
| Priority date | — |
| Expiry date | Dec 20, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K3/005
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Sensors are located on first and second regions of a heat sink, with a portion of the heat sink interposed between the first and second region sensors. The heat sink is connected to a component by an attachment that conducts heat from the component to the heat sink, and a third sensor is located on the component or the attachment with a portion of the attachment disposed between the third sensor and the first and second heat sink region sensors. Temperature readings from the sensors are compared to identify a failing one of the heat sink, the attachment portion, and the component with respect to heat conduction, which includes identifying the interposed heat sink portion as failing in response to a divergence between temperature inputs from the first and second heat sink region sensors. Rate-of-rise temperature readings may also be observed and compared, including to historical values.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.