Method for manufacturing a sensor array including a monolithically integrated circuit
US7858424B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2006 |
| Grant date | Dec 28, 2010 |
| Priority date | — |
| Expiry date | Sep 25, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0742
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method for producing a sensor array including a monolithically integrated circuit is described as well as a sensor array. This sensor array has a micromechanical sensor structure, in which a first partial structure which is associated with the sensor structure is produced at the same time as a second partial structure which is associated with the circuit, a process variation of the first partial structure being performed in order to adjust a structure property of the sensor structure while the second partial structure remains the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.