Integrated circuit encapsulation and method therefor
US7859068B2 · kind B2 · utility
0Cited by
24References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 3, 2009 |
| Grant date | Dec 28, 2010 |
| Priority date | — |
| Expiry date | Nov 3, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A device (12) may have a pressure sensitive portion (17) which is protected from corrosion by a pressure transmitting material (20). Pressure transmitting material (20) may also be used to transmit pressure to pressure sensitive portion (17). A masking material (22) may be used to define an opening (26) in encapsulating material (24).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.