Embedded integrated circuit package system
US7859098B2 · kind B2 · utility
6Cited by
7References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 19, 2006 |
| Grant date | Dec 28, 2010 |
| Priority date | — |
| Expiry date | Oct 19, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4602
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An embedded integrated circuit package system is provided forming a first conductive pattern on a first structure, connecting a first integrated circuit die on the first conductive pattern, forming a substrate forming encapsulation to cover the first integrated circuit die and the first conductive pattern, forming a channel in the substrate forming encapsulation, and applying a conductive material in the channel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.