Patent · US Active

Probe apparatus, probing method, and storage medium

US7859283B2 · kind B2 · utility

0Cited by

23References

13Claims

0Family size

Assignee

TOKYO ELECTRON LIMITED · JP

Inventors

Yasuhito Yamamoto · Nirasaki, JP
Masaru Suzuki · Yokohama, JP
Junichi Hagihara · Nirasaki, JP

Key dates

Filing date	Feb 20, 2009
Grant date	Dec 28, 2010
Priority date	—
Expiry date	Jul 26, 2029

Classification

Technology area (CPC G)Physics
CPC primaryG01R31/2893
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A probe apparatus is capable of being scaled-down and reducing a manufacturing cost thereof in a probe apparatus having a plurality of probe apparatus main bodies. A loader unit for transferring a wafer between carriers accommodating therein wafers and the probe apparatus main bodies includes: an upper camera for imaging the arrangement of chips to be inspected of the wafer; a lower camera for imaging probe needles; an X-Y-Θ stage for moving the position of the wafer W in a horizontal direction and a second loader mechanism for moving the wafer in a vertical direction. Accordingly, a fine alignment of the wafer is performed by the loader unit to adjust the position of the wafer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.