Patent · US Active

Semiconductor wafer, apparatus and process for producing the semiconductor wafer

US7867059B2 · kind B2 · utility

9Cited by

9References

16Claims

0Family size

Assignee

Siltronic AG · DE

Inventors

Georg Pietsch · Burghausen, DE
Michael Kerstan · Burghausen, DE
Werner Blaha · Tönning, DE

Key dates

Filing date	Nov 16, 2007
Grant date	Jan 11, 2011
Priority date	—
Expiry date	Oct 15, 2028

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB24D7/14
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

The invention relates to a process for producing a semiconductor wafer by double-side grinding of the semiconductor wafer, in which the semiconductor wafer is simultaneously ground on both sides, first by rough-grinding and then by finish-grinding, using a grinding tool. The semiconductor wafer, between the rough-grinding and the finish-grinding, remains positioned in the grinding machine, and the grinding tool continues to apply a substantially constant load during the transition from rough-grinding to finish-grinding. The invention also relates to an apparatus for carrying out the process and to a semiconductor wafer having a local flatness value on a front surface of less than 16 nm in a measurement window of 2 mm×2 mm area and of less than 40 nm in a measurement window of 10 mm×10 mm area.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.