Michael Kerstan
14Patents
5h-index
15Co-inventors
59Inventor score
Filing activity: May 25, 1999 → Feb 25, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8113913B2 | Method for the simultaneous grinding of a plurality of semiconductor wafers | Performing Operations; Transporting | 11 | Active |
| US7867059B2 | Semiconductor wafer, apparatus and process for producing the semiconductor wafer | Performing Operations; Transporting | 9 | Active |
| US7077726B2 | Semiconductor wafer with improved local flatness, and method for its production | Emerging Cross-Sectional Technologies | 7 | Expired |
| US7815489B2 | Method for the simultaneous double-side grinding of a plurality of semiconductor wafers | Performing Operations; Transporting | 7 | Active |
| US6362487B1 | Method and device for nondestructive detection of crystal defects | Electricity | 5 | Expired |
| US9539695B2 | Carrier, method for coating a carrier, and method for the simultaneous double-side material-removing machining of semiconductor wafers | Emerging Cross-Sectional Technologies | 2 | Active |
| US8974267B2 | Insert carrier and method for the simultaneous double-side material-removing processing of semiconductor wafers | Performing Operations; Transporting | 1 | Active |
| US9011209B2 | Method and apparatus for trimming the working layers of a double-side grinding apparatus | Performing Operations; Transporting | 1 | Active |
| US8512099B2 | Method for the simultaneous double-sided material removal processing of a plurality of semiconductor wafers | Performing Operations; Transporting | 1 | Active |
| US10707069B2 | Method for polishing a semiconductor wafer | Electricity | 0 | Active |
| US8911281B2 | Method for trimming the working layers of a double-side grinding apparatus | Performing Operations; Transporting | 0 | Active |
| US8685270B2 | Method for producing a semiconductor wafer | Electricity | 0 | Active |
| US8986070B2 | Method for trimming the working layers of a double-side grinding apparatus | Performing Operations; Transporting | 0 | Active |
| US8529315B2 | Method for producing a semiconductor wafer | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.