Integrated circuit package-on-package stacking system
US7868434B2 · kind B2 · utility
2Cited by
13References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 23, 2010 |
| Grant date | Jan 11, 2011 |
| Priority date | — |
| Expiry date | Mar 23, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package-on-package stacking system includes a leadframe interposer including: a leadframe having a lead; a molded base on a portion of the lead for only supporting the lead; and the leadframe interposer singulated from the leadframe, wherein the lead is bent to support a stack-up height.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.