Semiconductor device with a metallic carrier and two semiconductor chips applied to the carrier

US7868465B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Ralf Otremba · Kaufbeuren, DE
• Joachim Mahler · Regensburg, DE
• Bernd Rakow · Regensburg, DE
• Reimund Engl · Munich, DE
• Rupert Fischer · Maxhütte-Haidhof, DE

Key dates

• Filing date: Jun 4, 2007
• Grant date: Jan 11, 2011
• Expiry date: Dec 12, 2027

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/181
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A semiconductor device is disclosed. One embodiment provides a device including a carrier, an electrically insulating layer applied onto the carrier, an adhesive layer applied to the electrically insulating layer. A first semiconductor chip applied to the adhesive layer.