Integrated circuit package-in-package system with leads
US7868471B2 · kind B2 · utility
19Cited by
29References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 13, 2007 |
| Grant date | Jan 11, 2011 |
| Priority date | — |
| Expiry date | Nov 3, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package-in-package system includes: forming an integrated circuit package system including: connecting a first integrated circuit die and a lead, and forming an inner encapsulation covering the first integrated circuit die and a portion of the lead; mounting a second integrated circuit die to the integrated circuit package system; connecting the second integrated circuit die and the lead; and forming a package encapsulation covering the integrated circuit package system and the second integrated circuit die with the lead exposed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.