High density interconnect system having rapid fabrication cycle

US7872482B2 · kind B2 · utility

Assignee

• Verigy (Singapore) Pte. Ltd. · SG

Inventors

• Fu Chiung Chong · Saratoga, US
• Andrew Kao · Fremont, US
• Douglas McKay · San Jose, US
• Anna Litza · Los Gatos, US
• Douglas N. Modlin · San Mateo, US
• Sammy Mok · Cupertino, US
• Nitin Parekh · Los Altos, US
• Frank Swiatowiec · San Jose, US
• Zhaohui Shan · Spring, US

Key dates

• Filing date: Sep 19, 2007
• Grant date: Jan 18, 2011
• Expiry date: Oct 5, 2028

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49222
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

An improved interconnection system and method is described, such as for connectors, socket assemblies and/or probe card systems. An exemplary system comprises a probe card interface assembly (PCIA) for establishing electrical connections to a semiconductor wafer mounted in a prober. The PCIA comprises a motherboard parallel to the semiconductor wafer having an upper surface and an opposing lower planar mounting surface, a reference plane defined by a least three points located between the lower surface of the motherboard and the wafer, at least one component located below the motherboard mounting surface, and a mechanism for adjusting the planarity of the reference plane with respect to the wafer. A probe chip having a plurality of spring probes extending there from is mountable and demountable from the PCIA, without the need for further planarity adjustment. The interconnection structures and methods preferably provide improved fabrication cycles.