Probe arrays and method for making

US7878385B2 · kind B2 · utility

Assignee

• Microfabrica Inc. · US

Inventors

• Ananda H. Kumar · Fremont, US
• Ezekiel J. J. Kruglick · San Diego, US
• Adam L. Cohen · San Fernando, US
• Kieun Kim · Los Angeles, US
• Gang Zhang · Monterey Park, US
• Richard T. Chen · Burbank, US
• Christopher A. Bang · San Diego, US
• Vacit Arat · La Cañada Flintridge, US
• Michael S. Lockard · Boulder Creek, US
• Uri Frodis · Los Angeles, US
• Pavel B. Lembrikov · Santa Monica, US
• Jeffrey A. Thompson · Edwardsville, US

Key dates

• Filing date: Oct 30, 2007
• Grant date: Feb 1, 2011
• Expiry date: Sep 1, 2028

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/3841
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Embodiments of invention are directed to the formation of microprobes (i.e. compliant electrical or electronic contact elements) on a temporary substrate, dicing individual probe arrays, and then transferring the arrays to space transformers or other permanent substrates. Some embodiments of the invention transfer probes to permanent substrates prior to separating the probes from a temporary substrate on which the probes were formed while other embodiments do the opposite. Some embodiments, remove sacrificial material prior to transfer while other embodiments remove sacrificial material after transfer. Some embodiments are directed to the bonding of first and second electric components together using one or more solder bumps with enhanced aspect ratios (i.e. height to width ratios) obtained as a result of surrounding the bumps at least in part with rings of a retention material. The retention material may act be a solder mask material.