Coated lead frame

US7887928B2 · kind B2 · utility

Assignee

• Freeescale Semiconductor, Inc. · US

Inventors

• Chao Wang · Nanjing, CN
• Qing He · Bloomington, US
• Zhe Li · San Jose, US
• Zhijie Wang · 梅厂镇, CN
• Dehong Ye · Tianjin, CN

Key dates

• Filing date: May 30, 2008
• Grant date: Feb 15, 2011
• Expiry date: Sep 1, 2029

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/12646
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A lead frame having a coating of organic compounds on its lead fingers prevents tin and flux from contaminating the lead fingers after die attach. The coating is removed prior to wire bonding. The coating allows for reliable second bonds (bond between wires and lead fingers) to be formed, decreasing the likelihood of non-stick and improving wire peel strength.