Dehong Ye
7Patents
3h-index
16Co-inventors
46Inventor score
Filing activity: May 30, 2008 → Nov 18, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8329509B2 | Packaging process to create wettable lead flank during board assembly | Electricity | 15 | Active |
| US9406625B2 | Die edge seal employing low-K dielectric material | Electricity | 13 | Active |
| US9362211B1 | Exposed pad integrated circuit package with mold lock | Electricity | 5 | Active |
| US8288847B2 | Dual die semiconductor package | Electricity | 3 | Active |
| US8735223B2 | Semiconductor devices and methods of assembling same | Electricity | 1 | Active |
| US7887928B2 | Coated lead frame | Emerging Cross-Sectional Technologies | 1 | Active |
| US10283477B2 | Method of fabricating 3-dimensional fan-out structure | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.