Method of forming a wafer level package with RDL interconnection over encapsulant between bump and semiconductor die
US7888181B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2008 |
| Grant date | Feb 15, 2011 |
| Priority date | — |
| Expiry date | Oct 1, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device is made by providing a metal substrate for supporting the semiconductor device. Solder bumps are connected to the substrate. In one embodiment, a conductive material is deposited over the substrate and is reflowed to form the solder bumps. A semiconductor die is mounted to the substrate using a die attach adhesive. The semiconductor die has a plurality of contact pads formed over a surface of the semiconductor die. An encapsulant material is deposited over the solder bumps and the semiconductor die. The encapsulant is etched to expose the contact pads of the semiconductor die. A first redistribution layer (RDL) is formed over the encapsulant to connect each contact pad of the semiconductor die to one of the solder bumps. The substrate is removed to expose the die attach adhesive and a bottom surface of the solder bumps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.