Electronic module comprising memory and integrated circuit processor chips formed on a microchannel cooling device
US7888786B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 13, 2007 |
| Grant date | Feb 15, 2011 |
| Priority date | — |
| Expiry date | Apr 13, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Apparatus and methods are provided for integrating microchannel cooling modules within high-density electronic modules (e.g., chip packages, system-on-a-package modules, etc.,) comprising multiple high-performance IC chips. Electronic modules are designed such that high-performance (high power) IC chips are disposed in close proximity to the integrated cooling module (or cooling plate) for effective heat extraction. Moreover, electronic modules which comprise large surface area silicon carriers with multiple chips face mounted thereon are designed such that integrated silicon cooling modules are rigidly bonded to the back surfaces of such chips to increase the structural integrity of the silicon carriers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.